Ceramic materials play a crucial role in the semiconductor industry, and their applications run through various stages of semiconductor chip manufacturing. The following are some of the main applications of ceramic materials in the semiconductor industry:

Semiconductor equipment components: Ceramic materials are widely used in multiple components of semiconductor equipment due to their high hardness, high wear resistance, high insulation, corrosion resistance, low thermal expansion coefficient, and other characteristics. For example, polishing tables, polishing plates, and handling arms used in CMP (chemical mechanical polishing) processes; Vacuum suction cups, wafer chucks, workbenches, and handling arms during the photolithography process; And components such as insulators, bases, crystal boats, furnace tubes, cantilever propellers, etc. in high-temperature processing equipment such as RTP (rapid heat treatment), epitaxy, oxidation, diffusion, etc.

Etching equipment: In plasma etching equipment, components made of ceramic materials include window mirrors, gas dispersion disks, nozzles, insulation rings, cover plates, focusing rings, and electrostatic clamps. These components need to have excellent resistance to plasma etching to cope with the harsh conditions in the chip manufacturing process.

Ceramic substrate: As a key material for electronic device packaging, ceramic substrates are widely used in fields such as semiconductor lighting, sensors, and high-power device control modules. The types of ceramic substrates include flat ceramic substrates, multi-layer ceramic substrates, as well as DPC (direct copper plating), DBC (direct bonded copper), AMB (active metal brazing), LTCC (low-temperature co fired multi-layer ceramics), HTCC (high-temperature co fired multi-layer ceramics), etc. classified by process.

Optical communication components: Ceramic sleeves are important components in optical communication, fired and processed from zirconia powder, used for the active connection between optical fibers. With the development of technologies such as 5G networks, cloud computing, and the Internet of Things, the demand for ceramic sleeves in the construction of optical communication networks continues to grow.